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Features
TC4404/TC4405
General Description
The TC4404/TC4405 are CMOS buffer-drivers constructed with complementary MOS outputs, where the drains of the totem-pole output have been left separated so that individual connections can be made to the pull-up and pull-down sections of the output. This allows the insertion of drain-current-limiting resistors in the pull-up and/or pull-down sections, allowing the user to define the rates of rise and fall for a capacitive load; or a reduced output swing, if driving a resistive load, or to limit base current, when driving a bipolar transistor. Minimum rise and fall times, with no resistors, will be less than 30nsec for a 1000pF load. For driving MOSFETs in motor-control applications, where slow-ON/fast-OFF operation is desired, these devices are superior to the previously used technique of adding a diode-resistor combination between the driver output and the MOSFET, because they allow accurate control of turn-ON, while maintaining fast turnOFF and maximum noise immunity for an OFF device. When used to drive bipolar transistors, these drivers maintain the high speeds common to other Microchip drivers. They allow insertion of a base current-limiting resistor, while providing a separate half-output for fast turn-OFF. By proper positioning of the resistor, either npn or pnp transistors can be driven. For driving many loads in low-power regimes, these drivers, because they eliminate shoot-through currents in the output stage, require significantly less power at higher frequencies, and can be helpful in meeting low-power budgets.
1.5A Dual Open-Drain MOSFET Drivers
* Independently Programmable Rise and Fall Times * Low Output Impedance - 7 Typ. * High Speed tR, tF - <30nsec with 1000pF Load * Short Delay Times - <30nsec * Wide Operating Range - 4.5V to 18V * Latch-Up Protected: Will Withstand > 500mA Reverse Current (Either Polarity) * Input Withstands Negative Swings Up to -5V
Applications
* * * * Motor Controls Driving Bipolar Transistors Driver for Non-overlapping Totem Poles Reach-Up/Reach-Down Driver
Device Selection Table
Part Number TC4404COA TC4404CPA TC4404EOA TC4404EPA TC4404MJA TC4405COA TC4405CPA TC4405EOA TC4405EPA TC4405MJA Package 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP Temp. Range 0C to +70C 0C to +70C -40C to +85C -40C to +85C -55C to +125C 0C to +70C 0C to +70C -40C to +85C -40C to +85C -55C to +125C
Package Type
8-Pin PDIP/SOIC/CERDIP
VDD IN A IN B GND 1 2 8 7 A TOP A BOTTOM B TOP B BOTTOM VDD IN A IN B GND 1 2 8 7 A TOP A BOTTOM B TOP B BOTTOM
TC4404
3 4 6 5 3 4
TC4404
6 5
VDD IN A IN B GND
1 2
8 7
A TOP A BOTTOM B TOP B BOTTOM
VDD IN A IN B GND
1 2
8 7
A TOP A BOTTOM B TOP B BOTTOM
TC4405
3 4 6 5 3 4
TC4405
6 5
2002 Microchip Technology Inc.
DS21418B-page 1
TC4404/TC4405
Because neither drain in an output is dependent on the other, these devices can also be used as open-drain buffer/drivers where both drains are available in one device, thus minimizing chip count. Unused open drains should be returned to the supply rail that their device sources are connected to (pull-downs to ground, pull-ups to VDD), to prevent static damage. In addition, in situations where timing resistors or other means of limiting crossover currents are used, like drains may be paralleled for greater current carrying capacity. These devices are built to operate in the most demanding electrical environments. They will not latch up under any conditions within their power and voltage ratings; they are not subject to damage when up to 5V of noise spiking of either polarity occurs on their ground pin; and they can accept, without damage or logic upset, up to 1/2 amp of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 2kV of electrostatic discharge.
Functional Block Diagram
1 VDD
TC4404 Inverting 8 (6) Pull Up 7 (5)
300 mV
Pull Down
Input
2 (3) 4.7V TC4405 Noninverting
GND
4 Effective Input C 12 pF A (B)
DS21418B-page 2
2002 Microchip Technology Inc.
TC4404/TC4405
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage..................................................... +22V Power Dissipation (TA 70C) PDIP ........................................................ 730mW CERDIP ................................................... 800mW SOIC........................................................ 470mW Package Thermal Resistance PDIP RJ-A ............................................. 125C/W PDIP RJ-C ............................................... 45C/W CERDIP RJ-A.........................................150C/W CERDIP RJ-C ......................................... 55C/W SOIC RJ-A ............................................ 155C/W SOIC RJ-C .............................................. 45C/W Operating Temperature Range C Version .........................................0C to +70C E Version ..................................... -40C to +85C M Version................................... -55C to +125C Storage Temperature Range ............. -65C to +150C
TC4404/TC4405 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25C, with 4.5V VDD 18V, unless otherwise noted. Symbol Input VIH VIL IIN Output VOH VOL RO IPK IDC IR High Output Voltage Low Output Voltage Output Resistance Peak Output Current (Any Drain) Continuous Output Current (Any Drain) Latch-Up Protection (Any Drain) Withstand Reverse Current Rise Time Fall Time Delay Time Delay Time Power Supply Current
1: Switching times ensured by design.
Parameter
Min
Typ
Max
Units
Test Conditions
Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current
2.4 -- -1 VDD - 0.025 -- -- -- -- --
-- -- -- -- -- 7 1.5 -- >500
-- 0.8 1 -- 0.025 10 -- 100 --
V V
A
0V VIN VDD
V V
IOUT = 10mA, VDD = 18V; Any Drain Duty cycle 2%, t 300sec Duty cycle 2%, t 300sec
A mA mA
Switching Time (Note 1) tR tF tD1 tD2 IS
Note
-- -- -- -- -- --
25 25 15 32 -- --
30 30 30 50 4.5 0.4
nsec nsec nsec nsec mA
Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF VIN = 3V (Both Inputs) VIN = 0V (Both Inputs)
Power Supply
2002 Microchip Technology Inc.
DS21418B-page 3
TC4404/TC4405
TC4404/TC4405 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Over operating temperature range with 4.5V VDD 18V, unless otherwise noted. Symbol VIH VIL IIN Output VOH VOL RO IPK IDC IR High Output Voltage Low Output Voltage Output Resistance Peak Output Current (Any Drain) Continuous Output Current (Any Drain) Latch-Up Protection (Any Drain) Withstand Reverse Current Rise Time Fall Time Delay Time Delay Time Power Supply Current
1: Switching times ensured by design.
Parameter Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current
Min 2.4 -- -10 VDD - 0.025 -- -- -- -- --
Typ -- -- -- -- -- 9 1.5 -- >500
Max -- 0.8 10 -- 0.025 12 -- 100 --
Units V V
A
Test Conditions
0V VIN VDD
V V
IOUT = 10mA, VDD = 18V; Any Drain Duty cycle 2%, t 300sec Duty cycle 2%, t 300sec
A mA mA
Switching Time (Note 1) tR tF tD1 tD2 IS
Note
-- -- -- -- -- --
-- -- -- -- -- --
40 40 40 60 8 0.6
nsec nsec nsec nsec mA
Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF Figure 3-1, CL = 1000pF VIN = 3V (Both Inputs) VIN = 0V (Both Inputs)
Power Supply
DS21418B-page 4
2002 Microchip Technology Inc.
TC4404/TC4405
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (8-Pin PDIP, SOIC, CERDIP) 1 2 3 4 5 6 7 8
PIN FUNCTION TABLE
Symbol VDD IN A IN B GND B BOTTOM B TOP A BOTTOM A TOP Supply input, 4.5V to 18V. Control input A, TTL/CMOS compatible input. Control input A, TTL/CMOS compatible input. Ground. Output B, pull down. Output B, pull up. Output A, pull down. Output A, pull up. Description
2002 Microchip Technology Inc.
DS21418B-page 5
TC4404/TC4405
3.0
3.1
APPLICATIONS INFORMATION
Circuit Layout Guidelines
Avoid long power supply and ground traces (added inductance causes unwanted voltage transients). Use power and ground planes wherever possible. In
addition, it is advisable that low ESR bypass capacitors (4.7F or 10F tantalum) be placed as close to the driver as possible. The driver should be physically located as close to the device it is driving as possible to minimize the length of the output trace.
FIGURE 3-1:
SWITCHING TIME TEST CIRCUITS
+5V Input VDD = 18V 0V 18V 4.7F 1 0.1F Output 10% tD1 tF 90% tD2 tR 90% 90%
Input
2 1
8,7
Output CL = 1000pF
0V
10%
10%
Inverting Driver
+5V Input 0V 18V 10% 90% tR 10% 90% tF 10%
2
90%
4 Input: 100kHz, square wave, tRISE = tFALL 10nsec
tD1 Output 0V
tD2
Noninverting Driver
3.2
Typical Applications
ZERO CROSSOVER CURRENT TOTEM-POLE SWITCH FIGURE 3-3:
VDD (4.5V - 18V)
FIGURE 3-2:
DRIVING BIPOLAR TRANSISTORS
VDD (4.5V - 18V)
From TTL
RT
TC4404
RT
VOUT
From TTL
RIB
TC4405
RIB
GND
GND
DS21418B-page 6
2002 Microchip Technology Inc.
TC4404/TC4405
FIGURE 3-4:
+24V 47k +12V 15V 0.1F Direction (TTL Level) 15V 0.1F 47k
SERVO MOTOR CONTROL
Speed (PWM)
RT
Motor
RT
ISENSE GND TC4469
TC4404
FIGURE 3-5:
REACH-UP AND REACH-DOWN DRIVING
+12V +12V
Switched +12V +5V +5V
From TTL
TC4404
GND
GND Switched -12V
-12V
-12V
2002 Microchip Technology Inc.
DS21418B-page 7
TC4404/TC4405
4.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Fall Time vs. Supply Voltage
100 2200 pF
TA = +25C
Rise Time vs. Supply Voltage
100
Rise TIme vs. Capacitive Load
100
TA
2200 pF
TA = +25C
C
VDD
80
tRISE (nsec)
1500 pF
tFALL (nsec)
80
1500 pF
tRISE (nsec)
80
60 1000 p pF 40 470 pF 20 100 pF 0 4 6 8 10 12 14 16 18
60 1000 pF 40 470 p pF 20 100 pF F 0
60
10V 15V
40
20
4
6
8
10
12
14
16
18
0 100
VDD (V)
VDD (V)
1000 CLOAD (pF)
10,000
Fall Time vs. Capacitive Load
100
TA
Rise and Fall Times vs. Temperature
60
60
Propagation Delay vs. Supply Voltage
C
50
C
VDD = 5V
80
tFALL (nsec)
50
C = 1000pF VDD = 17.5V
= 1000pF C
DELAY TIME (nsec)
tD2 40
TIME (nsec)
60
10V 15V
40
40
30
tFALL
30 tD1 20
20
20
tRISE
0 100
1000 CLOAD (pF)
10,000
10 -55 -35 -15
5
25 45 65 85 105 125 C)
10
4
6
8
10
12 14 VDD (V)
16
18
Effect of Input Amplitude on Delay Time
60
CLOAD = 1000pF
Propagation Delay Time vs. Temperature
60
VDD = 17.5V V = 1000pF
Quiescent Supply Current vs. Voltage
10
TA = +25C
50
DELAY TIME (nsec)
DELAY TIME (nsec)
T
C
50
tD2
IQUIESCENT (mA)
BOTH INPUTS = 1 1
40
tD2
40
30
30
20
tD1
20
tD1
BOTH INPUTS = 0 0.1
10
0
2
4 6 VDRIVE (V)
8
10
10 -55 -35 -15 5
25 45 65 85 105 125 C)
4
6
8
10 12 VDD (V)
14
16
18
DS21418B-page 8
2002 Microchip Technology Inc.
TC4404/TC4405
TYPICAL CHARACTERISTICS (CONTINUED)
Quiescent Supply Current vs. Temperature
4.0
VDD = 18V BOTH INPUTS = 1
Pull-Up Output Resistance
25 25
Pull-Down Output Resistance
IQUIESCENT (mA)
3.5
20
20
3.0
RDS(ON) ()
RDS(ON) ()
WORST CASE @ TJ = +150C 15
WORST CASE @ TJ = +150C
15
2.5
10 8
TYP @ +25C
10 8 5
TYP @ +25C
2.0 -55 -35 -15 5
5 25 45 65 85 105 125
4 6 8 10 12 14 16 18
VDD (V)
4
6
8
10
12
14
16
18
TEMPERATURE (C)
VDD (V)
2002 Microchip Technology Inc.
DS21418B-page 9
TC4404/TC4405
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
5.2
Package Dimensions
8-Pin Plastic DIP
PIN 1
.260 (6.60) .240 (6.10)
.045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92)
.070 (1.78) .040 (1.02)
.310 (7.87) .290 (7.37)
.040 (1.02) .020 (0.51)
.015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87)
3 MIN.
.110 (2.79) .090 (2.29)
.022 (0.56) .015 (0.38)
Dimensions: inches (mm)
DS21418B-page 10
2002 Microchip Technology Inc.
TC4404/TC4405
Package Dimensions (Continued)
8-Pin CERDIP (Narrow)
.110 (2.79) .090 (2.29) PIN 1
.300 (7.62) .230 (5.84)
.055 (1.40) MAX. .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18)
.020 (0.51) MIN. .320 (8.13) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41)
Dimensions: inches (mm)
.150 (3.81) MIN.
3 MIN.
8-Pin SOIC
PIN 1
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) TYP.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40)
Dimensions: inches (mm)
8 MAX. .
2002 Microchip Technology Inc.
DS21418B-page 11
TC4404/TC4405
NOTES:
DS21418B-page 12
2002 Microchip Technology Inc.
TC4404/TC4405
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21418B-page13
TC4404/TC4405
NOTES:
DS21418B-page14
2002 Microchip Technology Inc.
TC4404/TC4405
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21418B-page 15
M
WORLDWIDE SALES AND SERVICE
AMERICAS
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03/01/02
' !$ '
DS21418B-page 16
2002 Microchip Technology Inc.


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